PART |
Description |
Maker |
S75WS256PEFKFF S75WS-P S71WS512PD0HFFLW3 S71WS256P |
based MCP/POP Products
|
SPANSION[SPANSION]
|
S72WS512PE0HF01G0 S72WS512PE0HF0GH2 S72WS256PD0HF0 |
based MCP/PoP Products
|
SPANSION[SPANSION]
|
S71WS256PD0KFFLW0 S71WS256PD0HFFLW2 S71WS256PD0KFF |
based MCP/POP Products 基于MCP持久性有机污染物产品
|
Spansion, Inc.
|
S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
|
Spansion Inc. Spansion, Inc.
|
S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品(MCP)的512兆位2兆16位)的CMOS 1.8伏,只有同时写,突发模式闪存
|
Spansion Inc. Spansion, Inc.
|
DS42585 AM29DL324D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM MCP Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
IRFP4228PBF |
pop switch
|
International Rectifier
|
AM49DL320BGB701T AM49DL320BGT701T AM49DL320BGT701S |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位个M × 8 2米x 16位).0伏的CMOS只,同时 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous 堆叠式多芯片封装(MCP)闪存和SRAM2兆位4个M × 8 2米x 16位).0伏的CMOS只,同时 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) Pseudo Static RAM SPECIALTY MEMORY CIRCUIT, PBGA73
|
Spansion, Inc. Spansion Inc. ADVANCED MICRO DEVICES INC Advanced Micro Devices, Inc.
|
GR-2022-1600 |
POP-IN ROCKER SWITCH D.P.-D.T
|
CW Industries
|